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Rogers PCB RO4000 dielectric material has long been mixed with FR-4 core boards and Prepreg to achieve performance upgrades in standard FR-4 multilayer designs. RO4003C, RO4350B, RO4360G2, RO4835, RO4835T, and RO4000 LoPro glass cloth reinforced, hydrocarbon resin/ceramic filler laminates have been used in signal layers that require high-performance boards due to operating frequency, dielectric constant, or high-speed signal requirements. FR-4 core board and Prepreg are still low-cost commonly used materials for non critical signal layers.
The RO4400 series Prepreg consists of four grades based on the RO4000 series core material and is compatible with RO4000 sheet metal in multi-layer board structures. Due to its high glass transition temperature Tg after curing, the fully cured RO4400 Prepreg does not undergo thermal degradation during multiple lamination processes, making the RO4400 series Prepreg an ideal choice for multi-layer board materials that require continuous production. In addition, the compression conditions compatible with FR4 enable the Prepreg of RO4400 and FR4 Prepreg in non-uniform multilayer boards to be completed through a single compression.
RO4450F Prepreg has improved the lateral flow adhesive performance and has become the preferred choice for new designs or an alternative product with filling difficulties in design. RO4460G2 Prepreg is a Prepreg bonding material with a dielectric constant (Dk) of 6.15. Like other RO4400 series Prepreg materials, this material has excellent tolerance control for dielectric constant and a low z-axis expansion coefficient to ensure the reliability of through holes. The RO4450T Prepreg has similar lateral flowability to the RO4450F Prepreg, providing designers with a variety of thickness options for fiber reinforced glass cloth Prepreg materials. Its flexibility is also necessary for high-level circuit board design.
RO4003C, RO4350B, RO4360G2, RO4835, RO4835T, and RO4000 LoPro Prepreg have all passed UL 94 V-0 flame retardant certification and are compatible with lead-free processing.
Characteristics of RO4450F, RO4450T, and RO4460G2
RO4450F and RO4450T have low dielectric constants (3.3~3.5) and loss factors (around 0.004)
RO4460G2 has a low Z-direction thermal expansion coefficient of 43ppm/° C
RO4450F has a high glass transition temperature Tg (>280 ° C TMA)
Compatible with FR-4 processing technology
Has electron migration resistance (CAF)
Compatible with lead-free soldering processes to meet environmental requirements
Typical applications of RO4450F, RO4450T, and RO4460G2
Digital circuit applications, such as servers, routers, and high-speed backboards
Cellular base station antenna and power amplifier
High frequency heads for satellite TV and live streaming satellites
Wireless Radio Frequency Identification (RFID)
Spread spectrum communication system
Automotive radar and sensors
Microwave point-to-point connection (P2P)
RO4835T high-frequency circuit board material is a low loss thermosetting material filled with ceramic and using special fiber glass cloth. There are three thicknesses to choose from: 2.5 mil, 3 mil, and 4 mil. Its dielectric constant (Dk) is 3.3, designed specifically for the inner layer of multi-layer board structures, and is a good supplement to RO4835 materials that require thinner thickness.
RO4450T Prepreg is also a low loss bonding material filled with ceramic and specially opened fiber glass cloth, with a dielectric constant of 3.2-3.3, which better enriches the product series of RO4835T and existing RO4000 high-frequency circuit board materials, with three thicknesses to choose from: 3 mil, 4 mil, and 5 mil.
CU4000 and CU4000 LoPro copper foils are sheet copper foil options provided for designers of multi-layer structures, and when used together with RO4000 products, they also have excellent adhesion to the outer copper foil.
RO4835T high-frequency circuit board material and RO4450T Prepreg material have excellent dielectric constant tolerance control, providing consistent circuit performance; Having a low z-axis thermal expansion coefficient ensures the reliability of electroplated vias; And it is compatible with the standard epoxy/glass (FR-4) processing flow. For multi-layer designs that require multiple continuous pressing, the above materials are undoubtedly an ideal choice, as fully cured RO4000 products can withstand multiple pressing cycles. Similarly, the flame retardant rating of RO4835T high-frequency circuit board material and RO4450T Prepreg meets UL 94 V-0 level and is compatible with lead-free process flow.