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RF Circuit Board

RF Circuit Board - RF Microwave PCB

RF Circuit Board

RF Circuit Board - RF Microwave PCB

  • RF Microwave PCB
    RF Microwave PCB

    Product Name: RF Microwave PCB

    Material: RF circuit materials

    Quality standard: IPC 6012

    Rogers PCB material Dk: 2.2-16

    Material composition: Ceramic, Teflon,

    Layer: 1L - 2L - multilayer PCB

    Thickness: 0.1mm - 12mm

    Copper thickness: 0.5oz - 6oz

    Surface technology: Silver, Gold,

    Application: RF microwave application

    Product Description Technical Information

    The operating frequency of RF microwave PCB ranges from 30 kHz to 100 GHz, and it is an important component of wireless communication, radar, broadcasting systems, and other high-frequency circuits. RF microwave circuit boards have special requirements in material selection, design layout, and manufacturing processes to ensure efficient signal transmission and reduce signal loss and interference.


    RF microwave PCB material selection: High frequency microwave circuit boards typically use materials with low loss, low dielectric constant (Dk), and low dielectric loss factor (Df), such as high-performance materials like PTFE (polytetrafluoroethylene) and Rogers PCB. These materials can effectively reduce energy loss and delay during signal transmission, ensuring signal integrity.

    RF microwave circuit layout: At high frequencies, the mutual influence (crosstalk) between signal lines and electromagnetic radiation become key challenges in design. Therefore, the design of high-frequency microwave circuit boards requires strict control of line width, line spacing, number and position of vias, and the use of specific transmission line technologies (such as microstrip lines and strip lines) to control impedance matching and reduce reflection and distortion.

    Grounding and shielding of RF microwave circuits: Good grounding design and electromagnetic shielding are key to ensuring the purity of high-frequency signals. High frequency microwave circuit boards often adopt measures such as multi-layer grounding layers and grounding shielding covers to isolate external interference and provide signal return paths, ensuring signal quality.

    Manufacturing of RF microwave PCB: The manufacturing of high-frequency microwave circuit board requires extremely high precision, including fine line etching, strict tolerance control, and special coating treatment to meet the needs of high-frequency signal transmission.


    The function of RF microwave PCB

    Communication system: In the fields of satellite communication, 5G/6G mobile communication, radar systems, etc., high-frequency microwave circuit boards are the core components for achieving high-speed data transmission and precise signal processing.

    Aerospace: In the navigation, communication, and radar detection systems of aerospace vehicles, high-frequency microwave circuit boards have become an indispensable part due to their excellent performance.

    Medical equipment: In high-end medical imaging devices such as MRI and CT scanners, high-frequency microwave technology is used to generate high-resolution images, which is crucial for diagnostic accuracy.

    Military equipment: High frequency microwave circuit boards are widely used in various electronic countermeasures, intelligence gathering, and weapon guidance systems.

    Radar technology: High frequency microwave circuit boards and substrates are widely used in signal processing units, transmission and reception modules in radar systems. By optimizing the design of circuit boards and substrates, the sensitivity and resolution of radar systems can be improved, achieving more accurate target detection.

    Microwave antenna: High frequency microwave substrate is a key component in building microwave antenna systems. They can achieve the transmission, demodulation, and radiation of microwave signals, improving the receiving and transmitting performance of antenna systems.


    RF microwave PCB

    RF microwave PCB

    Characteristics of RF Microwave PCB

    1. DK should be small and stable enough, usually the smaller the better. A high DK may cause signal transmission delay

    2. DF needs to be small, mainly affecting the quality of signal transmission. The smaller the direction finder, the smaller the signal, resulting in waste

    3. The thermal expansion rate should be as similar as possible to the copper foil, as the difference can cause the copper foil to separate during cold and hot changes

    4. The absorption rate of water must be low and high in humid environments, as the absorption rate of water can affect DK and DF

    5. Good heat resistance, chemical resistance, impact resistance, and peel resistance are required


    The below table shows some RF PCB   materials 
    RF ApplicationRF materialsDielectric Constant   (DK)Bonding MaterialsAttributes
    Consumer ElectronicsRO30066.15±0.15RO3000 SeriesCost effective with
        dependable electrical and thermal characteristics
    RO301010.2±0.03@10 GHzBondply
    RO48353.48±0.05@10 GHz2929 Bondply
    Military/Space
        Antenna & Communications System
    RT/Duroid 58802.20±0.02@10 GHzRO4450BThe best in electrical and thermal
        performance and environmental durability
    RO4000Low   DK loss for higher
        operating frequency designs
    RO4450F
    RO4003C3.38(+/-0.05)@10 GHz
    RO43503.48±0.05@10 GHz
    High   Power ApplicationsRT/Duroid 6035HTC3.6
    Superior thermal management
    XT/Duroid
    MedicalRO4350B3.48±0.05@10 GHzRO4400Versatile high Performance properties to suit a   range of device types


    Bondply / 2929


    Bondply
    AutomotiveRO30033.00±0.04@10 GHzRO4400Excellent electrical performance compatible with   standard manufacturing processes
    RO4000Sequential lamination   capableBondply
    RO4350B3.48±0.05@10 GHz
    IndustrialRO4835Spread   glass minimizes Dk
        variation
    Bondply / 2929Excellent durability and environmental
        resistances,including oxidation
    RO4350B3.48(+/-0.05)@10 GHzRO4400
    XT/Duroid
    Bondply
    Handheld device cellular /
        Wifi Antenna /Telematics and infotainment
    RO321010.2
    RO3000 Series laminates are circuit materials   with consistent mechanical properties,and the dielectric constant is stable   over a wide temperature range.
    RO30353.50(+/-0.05)
    Wifi/Computing/Radar/
        Power Amplifiers
    RO4500Excellent   mechanical rigidity for
        efficient and reliable installation

    Rogers RO4000 series hydrocarbon ceramic   laminates and prepregs are the industry leader. Used in microwave and   millimeter wave frequencies, this low loss material offers easier use in   circuit fabrication and streamlined properties over traditional PTFE materials.
    RO4700Dk   2.55 (+/- 0.05) or 3.0 (+/- 0.05)
    RO4830Insertion   loss similar to RO3003™ laminate with standard ED copper at 77GHz


    RF microwave PCB is an indispensable component in modern electronic devices, especially in fields such as communication, aerospace, military, and medical. With the advancement of technology, the application and impact of high-frequency PCBs will become more significant in the future. In the future PCB board and electronics industry, it will play a more critical role, and technological innovation and microwave PCB material research and development will be key factors driving the industry's development.

    Product Name: RF Microwave PCB

    Material: RF circuit materials

    Quality standard: IPC 6012

    Rogers PCB material Dk: 2.2-16

    Material composition: Ceramic, Teflon,

    Layer: 1L - 2L - multilayer PCB

    Thickness: 0.1mm - 12mm

    Copper thickness: 0.5oz - 6oz

    Surface technology: Silver, Gold,

    Application: RF microwave application


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